In the Netherlands, Pegasus Materials BV, a high-performance materials company combining chemistry, material science, and biomanufacturing, announced the debut of its first two materials and the expansion of its Seed round.
The new investment by venture studio Ferment and existing investor LIOF, alongside prior investment from Fibrant BV, will accelerate commercial scale-up of Pegasus’s products for the electronics, data center, and aerospace industries.
Pegasus Materials’ first product improves how electronic connectors are designed and manufactured — thinner walls, better electrical properties, higher yields — and its second brings new production-grade performance to 3D printing.
Virela-X001 is a bio-based high heat polyamide that combines high flow for smaller, more precise molding with ultra-low moisture uptake to reduce warping and blistering during production. The material is being evaluated by connector manufacturers for USB-C interconnects and for DDR memory connectors used in data center servers.
The second material, Virela-X002, is a partially bio-based polyimide for industrial 3D printing. Pegasus Materials is working with aerospace and defense partners to evaluate the material for use in aircraft components where strength, heat resistance, and weight savings are priorities.
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